Heat dissipating device

ABSTRACT

A heat dissipating device comprises a first body, a second body, and a working fluid, the first body having a first plate and a second plate combining with each other to together define a first chamber, the second body connecting the first body and having a second chamber communicating with the first chamber correspondingly, the working fluid filled in the first chamber and the second chamber. By means of the design of the structure of the present invention and through the circulation of the working fluid between the first chamber and the second chamber, the heat dissipating device of the present invention can achieve the effect of remote heat dissipation.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat dissipating device, and inparticular to a heat dissipating device with remote heat dissipation andan extended range of heat dissipation.

2. Description of Prior Art

With the rapid progress of technology industry, the functions ofelectronic devices are more and more powerful; for example, theoperational speeds of the electronic components in the centralprocessing unit (CUP), chip set, and display unit increase accordingly.As a result, the heat generated per unit time by the electroniccomponents is getting higher. Therefore, if the heat generated can notbe dissipated promptly, it will affect the effective operation of theelectronic device or cause damage to the electronic components.

The general heat dissipating devices used for the electronic componentsto remove heat in industry are mainly the heat dissipating componentssuch as fans, heat sinks and heat pipes. The heat is delivered bycontacting the heat sink and the heat source, and then is dissipatedafar via the heat pipe, or the fan is used to drive a forced wind flowto cool the heat sink. For a tiny space or a wider heat source, a vaporchamber is selected as a heat-conducting component for heat transfer ofthe heat source.

A traditional vapor chamber is formed by two plates combined together.Both or either of grooves and wick structures such as meshes andsintered bodies is disposed on the corresponding sides of the twoplates. The two plates are combined together to form a closed chamberwhich is at a vacuum state and is filled with a working fluid. In orderto increase the capillary attraction capability, the wick structures ofsintered coating copper pillars, sintered pillars and foam pillars areused as support and return paths. When the working fluid in the vaporchamber is heated at the vaporization area to vaporize, the workingfluid transforms from liquid to vapor. After the vapor working fluidflows to the condensation area of the vapor chamber, it transforms fromvapor to liquid. Then it flows back to the vaporization area through thecopper pillars to repeat the cycle. After the vapor working fluidcondenses into liquid droplets at the condensation area, gravity orcapillarity causes the working fluid to flow back to the vaporizationarea, achieving the effect of uniform heat dissipation.

However, the heat dissipation feature of the traditional vapor chamberonly works on the heat generated on or around the place the electroniccomponent is attached to the traditional vapor chamber.

According to the above, the prior art has the following disadvantages:

1. without the effect of remote heat dissipation;

2. a narrow heat dissipation range; and

3. a low heat dissipation rate.

Thus, how to overcome the disadvantages and problems of the prior art isthe focus of the inventor and related manufacturers in this fields todesperately study and improve.

SUMMARY OF THE INVENTION

In order to effectively overcome the above problems, the primaryobjective of the present invention is to provide a heat dissipatingdevice with remote heat dissipation.

The secondary objective of the present invention is to provide a heatdissipating device with an extended range of heat dissipation.

The further objective of the present invention is for provide a heatdissipating device with an increased heat dissipation rate.

In order to achieve the above objectives, the present invention providesa heat dissipating device comprising a first body, a second body, and aworking fluid; the first body has a first plate and a second platedisposed opposite to the first plate, the first plate and the secondplate combined with each other to together define a first chamber, afirst wick structure being formed on the inner wall of the firstchamber; the second body connects the first body and extends opposite tothe first body, the second body having a second chamber communicatingwith the first chamber correspondingly, a second wick structure beingformed on the inner wall of the second chamber; the working fluid isfilled in the first chamber and the second chamber.

By means of the design of the structure of the present invention, thestructure of corresponding communication between the first chamber ofthe first body and the second chamber of the second body, when the firstbody is heated, the liquid working fluid is heated and vaporized intovapor. Then, part of the vapor working fluid in the first chamber flowstoward the second chamber of the second body due to the communicationstructure between the first and second chambers. By the circulation ofthe vapor working fluid between the first and second chambers, theeffect of remote heat dissipation can be achieved. Besides, the range ofheat dissipation can be extended and the heat dissipation rate can beincreased.

BRIEF DESCRIPTION OF DRAWING

FIG. 1A is an assembled perspective view of the heat dissipating deviceaccording to the first embodiment of the present invention;

FIG. 1B is a cross-sectional view of the heat dissipating deviceaccording to the first embodiment of the present invention;

FIG. 2 is an assembled perspective view of the heat dissipating deviceaccording to the second embodiment of the present invention;

FIG. 3 is a cross-sectional view of the heat dissipating deviceaccording to the third embodiment of the present invention;

FIG. 4 is a cross-sectional view of the heat dissipating deviceaccording to the fourth embodiment of the present invention;

FIG. 5 is a cross-sectional view of the heat dissipating deviceaccording to the fifth embodiment of the present invention;

FIG. 6 is an assembled perspective view of the heat dissipating deviceaccording to the sixth embodiment of the present invention; and

FIG. 7 is an assembled perspective view of the heat dissipating deviceaccording to the seventh embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The above objectives and structural and functional features of thepresent invention will be described with reference to the accompanyingdrawings.

Please refer to FIGS. 1A and 1B, which are the assembled perspectiveview and cross-sectional view of the heat dissipating device accordingto the first embodiment of the present invention, respectively. The heatdissipating device comprises a first body 1, a second body 2, and aworking fluid 3. The first body 1 has a first plate 10 and a secondplate 11 disposed opposite to the first plate 10, the first plate 10 andthe second plate 11 combined with each other to together define a firstchamber 101, a first wick structure 102 being formed on the inner wallof the first chamber 101. The first wick structure 102 can be one ofsintered powder, mesh, fiber, foam and porous material. The first body 1further has a hole 103.

The above-mentioned second body 2 connects the first body 1 and extendsopposite to the first body 1. The second body 2 has a second chamber 211communicating with the first chamber 101 correspondingly. A second wickstructure 212 is formed on the inner wall of the second chamber 211. Thesecond wick structure 212 is one of sintered powder, mesh, fiber andgrooves. The second body 2 further has an open end 213 at one endthereof (a closed end at the other end thereof, not shown, disposed awayfrom the first body 1) and the open end 213 connects the first plate 10and the second plate 11 correspondingly. The open end 213 is insertedinto the first chamber 101 and connected to the hole 103correspondingly.

The above-mentioned working fluid 3 is filled in the first chamber 101of the first body 1 and the second chamber 211 of the second body 2.

In the current embodiment, a heat spreader is used as the first body 1and a heat pipe is used as the second body 2 for the purpose ofexplanation, but not limited to the above examples.

Thus, by means of the design of the heat dissipating device of thepresent invention, using the corresponding connection between the hole103 of the first body 1 and the open end 213 of the second body 2enables the corresponding communication between the first chamber 101 ofthe first body 1 and the second chamber 211 of the second body 2. Whenthe first body 1 is heated, the liquid working fluid 3 is heated andthen vaporized into the vapor working fluid 3. Next, part of the vaporworking fluid 3 in the first chamber 101 flows toward the second chamber211 of the second body 2 due to the communication structure between thefirst and second chambers 101, 211. This makes part of the vapor workingfluid 3 flow from the first chamber 101 to the second chamber 211 todissipate the heat. With the continuous circulation of the working fluid3 between the first and second chambers 101, 211, the uniform heatdissipation is achieved by the first body 1 and the effect of remoteheat dissipation is further achieved by the second body 2; furthermore,the range of heat dissipation is extended and the rate of heatdissipation is increased.

Please refer to FIGS. 2 and 1A; the former is an assembled perspectiveof the heat dissipating device according to the second embodiment of thepresent invention. In the second embodiment, some components of the heatdissipating device and the corresponding relation among the componentsare the same as those in the first embodiment, not described again here.The main difference of the heat dissipating devices between the secondand first embodiments is that the second body 2 in the second embodimentfurther has an upper pipe surface 21 and a lower pipe surface 22, theupper pipe surface 21 and the lower pipe surface 22 together definingthe second chamber 211, the second body 2 being flattened. By means ofthe structure of corresponding communication between the first chamber101 and the second chamber 211, part of the vapor working fluid 3 in thefirst chamber 101 can flow toward the second chamber 211 of the secondbody 2. This makes the working fluid 3 circulate continuously betweenthe first and second chambers 101, 211. As a result, the effects ofuniform heat dissipation and remote heat dissipation can be achieved.

Please refer to FIGS. 3 and 1A; the former is a cross-sectional view ofthe heat dissipating device according to the third embodiment of thepresent invention. In the third embodiment, some components of the heatdissipating device and the corresponding relation among the componentsare the same as those in the above-mentioned embodiments, not describedagain here. The main difference of the heat dissipating devices betweenthe third and first embodiments is that the first body 1 in the thirdembodiment further has at least one supporting structure 4. Thesupporting structure 4 is one of a copper pillar, a sintered powdercolumn and an annulus, two ends of the supporting structure 4 connectingthe first plate 10 and the second plate 11, respectively. By means ofthe above-mentioned supporting structures 4, when the second plate 11 isheated, the liquid working fluid 3 is vaporized and transformed to thevapor working fluid 3. The vapor working fluid 3 flows toward the firstplate 10 and contacts the inner wall of the first plate 10 and then iscondensed back into the liquid working fluid 3. After that, the liquidworking fluid 3 is drawn back to the second plate 11 by means of thesupporting structures 4.

Please refer to FIGS. 4 and 1A; the former is a cross-sectional view ofthe heat dissipating device according to the fourth embodiment of thepresent invention. In the fourth embodiment, some components of the heatdissipating device and the corresponding relation among the componentsare the same as those in the above-mentioned embodiments, not describedagain here. The main difference of the heat dissipating devices betweenthe fourth and first embodiments is that the second body 2 in the fourthembodiment further has at least one supporting structure 4. Thesupporting structure 4 is one of a copper pillar, a sintered powdercolumn and an annulus. Two ends of the supporting structure 4 connectthe upper pipe surface 21 and the lower pipe surface 22, respectively.

Please refer to FIGS. 5 and 1A; the former is a cross-sectional view ofthe heat dissipating device according to the fifth embodiment of thepresent invention. In the fifth embodiment, some components of the heatdissipating device and the corresponding relation among the componentsare the same as those in the above-mentioned embodiments, not describedagain here. The main difference of the heat dissipating devices betweenthe fifth and first embodiments is that both the first and second bodies1, 2 in the fifth embodiment have at least one supporting structure 4.By means of the supporting structure 4, when the second body 11 isheated, the liquid working fluid 3 is vaporized and transformed to thevapor working fluid 3 which is then condensed back into the liquidworking fluid 3 in the first and second chambers 101, 201. After that,the liquid working fluid 3 is drawn back to the second plate 11 and thelower pipe surface 22 by means of the supporting structure 4.

Also, the materials of the first body 1 and second body 2 can be one ofcopper, aluminum and highly thermoconductive material.

Finally, please refer to FIGS. 6 and 7, which are the assembledperspective views of the heat dissipating devices according to the sixthand seventh embodiments of the present invention, respectively. In thecurrent embodiments, some components of the heat dissipating device andthe corresponding relation among the components are the same as those inthe above-mentioned embodiments, not described again here. The maindifference of the heat dissipating devices between the current and aboveembodiments is that in the application of the present invention, therecan be a first body 1 connecting plural second bodies 2, a second body 2connecting two first bodies 1, or plural first bodies 1 and pluralsecond bodies 2 connecting to each other.

In summary, the present invention has the following advantages over theprior art:

1. the effect of remote heat dissipation;

2. an extended range of heat dissipation; and

3. an increased rate of heat dissipation.

Although the present invention has been described above with referenceto the foregoing preferred embodiments, it will be understood that theabove embodiments are not to limit the scope of the present invention.Various equivalent variations and equivalent modifications according tothe scope of the present invention are also embraced within the scope ofthe invention as defined in the appended claims.

What is claimed is:
 1. A heat dissipating device, comprising: a firstbody having a first plate and a second plate disposed opposite to thefirst plate, the first plate and the second plate combined with eachother to together define a first chamber, a first wick structure beingformed on the inner wall of the first chamber; a second body connectingthe first body at one end thereof and extending opposite to the firstbody from the other end thereof, the second body having a second chambercommunicating with the first chamber correspondingly, a second wickstructure being formed on the inner wall of the second chamber; and aworking fluid filled in the first chamber and the second chamber.
 2. Theheat dissipating device according to claim 1, wherein the second bodyfurther has an upper pipe surface and a lower pipe surface, the upperpipe surface and the lower pipe surface together defining the secondchamber.
 3. The heat dissipating device according to claim 2, whereinthe second body further has an open end at one end thereof, the open endconnecting the first plate and the second plate correspondingly.
 4. Theheat dissipating device according to claim 3, the first body further hasa hole connecting the open end correspondingly.
 5. The heat dissipatingdevice according to claim 1, wherein the first wick structure is one ofsintered powder, mesh, fiber, foam, and porous material.
 6. The heatdissipating device according to claim 1, wherein the second wickstructure is one of sintered powder, mesh, fiber, and grooves.
 7. Theheat dissipating device according to claim 1, wherein the first bodyfurther has at least one supporting structure, the supporting structurebeing one of a copper pillar, a sintered powder column and an annulus,two ends of the supporting structure connecting the first plate and thesecond plate, respectively.
 8. The heat dissipating device according toclaim 2, wherein the second body further has at least one supportingstructure, the supporting structure being one of a copper pillar, asintered powder column and an annulus.
 9. The heat dissipating deviceaccording to claim 1, wherein the first body is a heat spreader.
 10. Theheat dissipating device according to claim 1, wherein the second body isa heat pipe.